A European research and industry consortium has unveiled a laser-based manufacturing process that could significantly accelerate the adoption of 2D materials in mainstream semiconductor production.
Developed under the Horizon Europe–funded L2D2 project, the technique enables graphene and related atomically thin materials to be transferred directly onto CMOS-compatible and silicon photonics wafers, overcoming a long-standing barrier to industrial-scale integration.
The LDT process allows engineers to transfer microscopic 'patches' of 2D materials with micron-scale precision, eliminating the need for chemical adhesives that often contaminate devices and reduce performance.
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