· Proprietary high-speed silicon MZM and hybrid polymer modulators achieving >70 GHz bandwidth.

· Optimized low Vπ·L (<1.5 V·cm) design with advanced traveling-wave electrodes ensures low drive voltage and high linearity.

· Supports PAM4 / NRZ / QAM modulation up to 400G / 800G / 1.6T link capacity.

· Provides both CPO (Co-Packaged Optics) and LPO (Linear Pluggable Optics) options for high-speed, low-power integration at chip level.

· Utilizes tri-layer hard-mask deep etch and LPCVD SiN processes, achieving sidewall roughness < 2 nm.

· Demonstrates < 0.1 dB/cm propagation SIN WG loss — significantly lower than the industry norm (0.4–1 dB/cm).

· Low-stress waveguide stack ensures stable performance across O/C/L bands for interferometers, filters, and modulators.

· Patented graded-index tapered coupler with 3D alignment-tolerant design, achieving < 0.5 dB coupling loss per facet.

· Compatible with SMF, PMF, and SiN waveguides, supporting broadband operation from O to L band.

· Provides ±1.5 μm alignment tolerance and is insensitive to adhesive refractive-index variations, ensuring consistent optical performance in mass packaging.

· On-chip MUX/DEMUX co-designed with modulator, P, and edge coupler to form a complete Tx/Rx photonic link.

· Achieves < 0.5 dB insertion loss and < 0.05 nm channel tolerance, ensuring high isolation and low crosstalk.

· At 200G/lane Rx, the integrated Demux effectively eliminates the bandwidth and crosstalk limitations of conventional PIN PD + external Demux architectures.